Hot Sale Silver Lead Free SMT Solder Paste For SMD Soldering SMD Components

Specifications:

Product name: Solder Paste

Alloy: Sn99Ag0.3Cu0.7

Size: μm: 25~45

Application: fine space 400μm, super fine space with NO.5

melting point: 217~219

metal content%: 89.5~90.2

conglutination: 700~1000Pa.s

life: 12 months

module life: >24 hours

printing speed: most 150mm/s

adhere time: >24 hours

Description:

Main ingredients is KF, KBF4, B2O3, composite fluorine borates composite borates, activator and so on. Excluding banned substances

Its performance is stable usage convenience, long-term storage not solidify, activity is strong, good fluidity.

Application:

Lead-free solder flux pastes is suitable in repairs of SMD and so on handset PCB, BGA and PGA helps the soldering paste, it uses activator of system in the low iconicity, the Run tin speed is quick, the belching smoke degree is very low, after the residuum solidifies, the surface insulation resistance value is very high, therefore, electric properties of disturbances to communication product and so on handset is small.

CONTACT US

Terrence Trading Limited

Contact Person: Jo Wan

Mobile Phone: +86-18823363695

Email: terrenetradingltd@foxmail.com

Skype: licpao2324

QQ: 3104221453

Address: Baoan District, Shenzhen, China